AVI Photomask Metrology System

Accurate defect and CD measurements while your plates are on your inspection tool

  • SEM Accuracy or better
  • Use on masks with or without pellicles
  • Defect/line measurement down to 0.1 µ
  • Contact measurement down to 0.3 µ
  • Operates on binary or half-tone masks
  • 5nm repeatability on hard / soft defects
  • Measure defects while reviewing
  • Operator-independent results
  How does it work?  
What can I measure?

Why do I need it?
AVI System Photo Accuracy and repeatability?

Can I save money?
  System Specs  
 
AVI measurements correlate to printed defect size twice as well as SEM measurements. Reference: Defect printability measurement on the KLA-351: Correlation to defect sizing using the AVI Metrology System by Intel Corporation and AVI.

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  HOW DOES IT WORK?

    The AVI sits next to your existing reticle inspection tool or other microscope, and uses its video signal to measure sizes accurately.

    During defect review, the operator turns to the AVI system and clicks on the defect in question.

    In one second, the AVI’s patented Flux Area Measurement™ measures the amount of light the defect blocks or absorbs. Size is displayed as diameter or area.

    The defect measurements, image and information are saved to a database for later review and analysis.

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  WHAT CAN I MEASURE?

Defect Image DEFECTS: Down to 0.08 µ and smaller Contact Hole Image CONTACT HOLES: 2-10 nm repeatability.
Line Width Image LINE WIDTH: Down to 0.25 µ. 1-2 nm repeatability. OPC Image OPC: 2-10 nm repeatability (1 sigma)
Edge Roughness Image EDGE ROUGHNESS: 1-2 nm repeatability. Corner Radius Image CORNER RADIUS: 2-10 nm repeatability.
Pitch Image PITCH: 1 part in 1000 Butting Error Image BUTTING ERROR: 1-2 nm repeatability.
Large Defect Image LARGE DEFECTS: Maximum dimension size    
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  SYSTEM SPECIFICATIONS  (Highlights  —  Technical Specs  —   Options)


System Highlights:

 SEM accuracy or better: Measure defects / lines as small as 0.1 µm, contacts down to 0.3 µm.
 Excellent repeatability: 5 nm, or 1% of size, on hard and soft defects.
 Objective measurements: Get accurate, operator-independent results.
 Easy to use: Measure defects while reviewing; requires just one mouse-click.
 Fast: Highly reliable measurements in one second.
 Repair / reject fewer masks.
 Small Footprint: works with your existing reticle inspection system.
 Increases reticle inspection system throughput and utilization.
 Recover investment quickly: typical payback in only two months.


Technical Specs:

Measurements:
    Measures hard and soft defects:
        Text Bullet  Diameter, Opacity, Height/Width, Max. Dimension
    Line width and butting error down to 0.1 µ
    Contact Size (Area)
    Edge and CD Uniformity (range and standard deviation)
    Corner Radius (absolute)
    OPC: Area, Separation, Asymmetry
    Built-in Statistics: Mean, Standard Deviation, Range

Operates on standard or phase-shift masks

Defect Size Range: 0.08 to 1.5 µ. Up to 100 µ depending on video source

Accuracy: 2% of defect size

Repeatability: 5 nm, or 1% of the defect size on defects 0.25 µ and larger. 7 nm for defects 0.08 µ to 0.25 µ.

Speed: 1-5 seconds per measurement

Compatibility: KLA3xx (including UV systems), KLA Starlight, KLA 2xx, Lasertec, DRS-I, DRS-II, KMS, Nikon, Probing Solutions, others on request

Calibration: Single-point calibration using a line pattern with known pitch.

Output: Screen, printout, email, spreadsheet and database

Defect Library: Images and measurements are stored in database for later review and analysis. Defect lists may be retrieved by customer, mask ID, comment, keyword, or date.

Equipment: Image processing computer; ethernet ready


System Options:

Interfaces for KLA-3xx, KLA-2xx, Lasertec, KMS, LWM, ARIS-I, DRS, PSI

Network defect review

Video Switch for sharing existing monitor

Maintenance and upgrade agreement

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